Title:
回路基板及び電子部品の実装方法
Document Type and Number:
Japanese Patent JP6382028
Kind Code:
B2
Abstract:
A circuit board, provided with: (1) an electronic component including a first substrate, an electrode provided on at least one surface of the first substrate, a meltable conductor provided on the electrode, an outer casing having an internal space for housing the meltable conductor and having one or more vents, and a first sealing member for sealing the vents; (2) a second substrate on which the electronic compound is provided; and (3) a second sealing member for sealing the electronic component provided on the second substrate.
Inventors:
Yuji Furuuchi
Kazutaka Furuta
Muko City
Kazutaka Furuta
Muko City
Application Number:
JP2014171770A
Publication Date:
August 29, 2018
Filing Date:
August 26, 2014
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H01H37/76
Foreign References:
| WO2014123139A1 |
Attorney, Agent or Firm:
Nobuhiro Noguchi