Title:
ハーフカット加工用粘着フィルム及び被着体の加工方法
Document Type and Number:
Japanese Patent JP6863770
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive film for half cut processing hardly generating slip stick phenomenon during peeling and having no generation of position lag of an adherend when used in processing method of the adherend including half cut processing, and a processing method of the adherend including the half cut processing using the adhesive film for half cut processing.SOLUTION: There is provided an adhesive film for half cut processing for being peeled from an adherend after conducting half cut processing on the adherend at a state with laminated on a surface of the adherend of which the surface has arithmetic average roughness Ra of 1.0 μm to 2.0 μm and ten point average roughness Rz of 5 μm to 15 μm, having a substrate layer and an adhesive layer, the adhesive layer containing a styrenic elastomer and a terpene phenol-based tackifier, and storage elastic modulus G' at 23°C of the adhesive layer is 1.8 MPa to 2.5 MPa.SELECTED DRAWING: None
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Inventors:
Fumune Shimomura
Guo
Kunihiro Hino
Guo
Kunihiro Hino
Application Number:
JP2017033843A
Publication Date:
April 21, 2021
Filing Date:
February 24, 2017
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
C09J7/38; B65H41/00; C09J11/08; C09J125/04
Domestic Patent References:
| JP2000080336A | ||||
| JP2010241152A | ||||
| JP2011006523A | ||||
| JP2014201623A | ||||
| JP2014040593A | ||||
| JP2016060796A |
Foreign References:
| WO2010029773A1 |
Attorney, Agent or Firm:
Atomi International Patent Office