構造物を補強または補修する方法

Japanese Patent JP7050536

B2

To provide a method for reinforcing or repairing a structure using a reinforcement material containing reinforcing fibers and matrix resin capable of suppressing occurrence of void while shortening construction time, in the case of performing thermal cure in a state where an uncured adhesive resin composition layer and a reinforcement layer containing matrix resin are laminated on the surface of the structure.SOLUTION: A method for reinforcing or repairing a structure includes: a lamination step of laminating a reinforcement layer containing reinforcing fibers and matrix resin soaked in it at a curing temperature tb(°C) via an adhesive resin composition layer at a curing temperature ta(°C), on the surface of the structure; a first heating step of heating at a first heating temperature T1(°C); and a second heating step of heating at a second heating temperature T2(°C). Here, ta(°C), tb(°C), T1(°C) and T2(°C) satisfy the following relationship:(i)ta