Title:
配線の断線修復方法
Document Type and Number:
Japanese Patent JP4465065
Kind Code:
B2
Abstract:
A method of repairing a disconnected wiring, which has a step of connecting a main wiring in which disconnection is caused and a spare wiring which is formed on or under the main wiring via an interlayer insulating film in their intersecting region of the main and spare wirings, comprising the steps of opening a hole by irradiating a laser beam of a first output intensity from a laser to the intersecting region of the main wiring and the spare wiring, and connecting the spare wiring and the main wiring by melting a part of the spare wiring and the main wiring by irradiating a laser beam of a second output intensity, which is different from the first output intensity, toward the hole.
Inventors:
Yasufumi Kanayama
Application Number:
JP29254699A
Publication Date:
May 19, 2010
Filing Date:
October 14, 1999
Export Citation:
Assignee:
Sharp Corporation
International Classes:
G09F9/00; G09F9/30; B23K26/351; B23K26/361; G02F1/1343; G02F1/136; G02F1/1362; H01L21/768; H05K3/22; H05K3/46
Domestic Patent References:
| JP3133135A | ||||
| JP9244048A | ||||
| JP63183481A | ||||
| JP6285661A |
Foreign References:
| WO1996007122A1 |
Attorney, Agent or Firm:
Keizo Okamoto