Title:
スライス動作のシーケンス中にワイヤソーによって被加工物から複数のウェハをスライスする方法
Document Type and Number:
Japanese Patent JP7475464
Kind Code:
B2
Abstract:
Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixed and moveable bearings. During each of the slicing operations, the setting device feeds the workpiece through the wire web along a feed direction perpendicular to a workpiece axis and perpendicular to the plane of the wire web. During each of the slicing operations, the movable bearings move oscillatingly axialy. The feeding of the workpiece through the wire web includes a simultaneous displacement of the workpiece along the workpiece axis using the setting element in accordance with a correction profile, which includes an oscillating component that is opposite to the effect which the axial moving of the movable bearings has on the shape of the sliced-off wafers.
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Inventors:
Peach,georg
Beesner, Peter
Beesner, Peter
Application Number:
JP2022545911A
Publication Date:
April 26, 2024
Filing Date:
January 18, 2021
Export Citation:
Assignee:
Siltronic AG
International Classes:
H01L21/304; B24B27/06; B24B55/02; B28D5/04; H01L21/683
Domestic Patent References:
| JP9286021A | ||||
| JP11165251A | ||||
| JP2012200861A | ||||
| JP2015212007A | ||||
| JP11347910A |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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