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Title:
調湿装置
Document Type and Number:
Japanese Patent JP4179052
Kind Code:
B2
Abstract:

To provide a moisture conditioning device using a refrigerating cycle for regenerating adsorbing materials and cooling air, having improved moisture conditioning performance by shortening a time after operation change-over in a refrigerant circuit but before the adsorbing materials start sufficient adsorption/desorption of moisture.

In the refrigerant circuit of the moisture conditioning device 10, the adsorbing materials are supported on the surfaces of first and second heat exchangers 61, 62. In the refrigerant circuit, the direction of circulating refrigerant is changeable over by the operation of a four-way valve. The moisture conditioning device 10 uses the heat exchangers 61, 62 as evaporators for dehumidifying first air and uses the heat exchangers 61, 62 as condensers for humidifying second air. When the temperature of the second air is higher than that of the first air, an air distribution passage is changed over before operation change-over in the refrigerant circuit. Conversely, when the temperature of the first air is higher than that of the second air, the air distribution passage is changed over after the operation change-over in the refrigerant circuit.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Shuji Ikegami
Tomohiro Yabu
Application Number:
JP2003149252A
Publication Date:
November 12, 2008
Filing Date:
May 27, 2003
Export Citation:
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Assignee:
Daikin Industries, Ltd.
International Classes:
F24F3/14; F24F11/02; F25B13/00
Domestic Patent References:
JP10267576A
JP57065550A
JP60016973U
JP2000274782A
JP1312339A
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama
Hiroshi Takeuchi
Takahisa Shimada
Yuji Takeuchi
Katsumi Imae
Atsushi Fujita
Kazunari Ninomiya
Tomoo Harada
Takashi Goto
Iseki Katsumori



 
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