Title:
HYBRID IC DEVICE
Document Type and Number:
Japanese Patent JPH0774293
Kind Code:
A
Abstract:
PURPOSE: To enhance accuracy in the bonding of a board and to stabilize the characteristics of a device by preventing positional shift of the board from a heat sink.
CONSTITUTION: The cap fixing part 3b is bent inward at the opposite ends thereof to abut on the board 1 on the sides intersecting the cap fixing part 3b thus forming positional shift preventing parts 3d on the heat sink 3.
Inventors:
NISHIKAWA YOSUKE
FUJIWARA HIDEKI
FUJIWARA HIDEKI
Application Number:
JP21742593A
Publication Date:
March 17, 1995
Filing Date:
September 01, 1993
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/40; (IPC1-7): H01L23/40
Attorney, Agent or Firm:
Soga Doteru (6 people outside)
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