PURPOSE: To easily replace an integrated circuit substrate after a hybrid integrated circuit device is completed, by forming at least one or more holes in a specified region of case material, accommodating a connection means in the hole, and pressure-welding and connecting a connection pad and the connection means.
CONSTITUTION: Two holes 32 corresponding with connection pads 14, 24 formed at arbitrary positions on both substrates 10, 20 are formed in case material 30. Connection means 40 are accommodated in the holes 32. By pressing and fixing the first substrate 10 to the case material 30, the connection means 40 having elastic force is compressed. Both of the connection pads 14 and 24 formed in the regions of both substrates 10 and 20 except the peripheral parts are connected by the compressive force, and both substrates 10 and 20 are mutually connected. Thereby the substrates can be easily replaced when defect or the like is generated after a device is completed.
KIKUCHI HIROBUMI
SHIMIZU HISASHI
