Title:
ハイブリッド集積回路装置およびその形成のための方法
Document Type and Number:
Japanese Patent JP5205623
Kind Code:
B2
Abstract:
An embodiment of a method to form a hybrid integrated circuit device is described. This embodiment of the method comprises: forming a first die using a first lithography, where the first die is on a substrate; and forming a second die using a second lithography, where the second die is on the first die. The first lithography used to form the first die is a larger lithography than the second lithography used to form the second die. The first die is an IO die.
Inventors:
Carp, james
Young, Stephen Py
New, Bernard Jay
Nonce, scot s
Crotty, Patrick Jay
Young, Stephen Py
New, Bernard Jay
Nonce, scot s
Crotty, Patrick Jay
Application Number:
JP2010539541A
Publication Date:
June 05, 2013
Filing Date:
October 21, 2008
Export Citation:
Assignee:
XILINX INCORPORATED
International Classes:
H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2007265019A | ||||
| JP8167703A | ||||
| JP2002246538A | ||||
| JP11168185A | ||||
| JP2005217205A | ||||
| JP2007266182A |
Foreign References:
| US20040178819 |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa
Masato Sasaki
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Masayuki Sakai
Nobuo Arakawa
Masato Sasaki