Title:
ハイブリッド型感光性樹脂およびその製造方法
Document Type and Number:
Japanese Patent JP6680910
Kind Code:
B2
Abstract:
This invention discloses a hybrid photosensitive resin and a preparation method thereof. This hybrid photosensitive resin has a structure represented by general formula (I) and contains an oxetanyl functional group and a (meth)acryloxy functional group. The functional groups are coordinated with each other and the functionality is adjustable and controllable. The hybrid photosensitive resin is highly suitable for radical-cation photocuring systems, there is no problem of polymerization inhibition by oxygen, and its cured film has high hardness, good flexibility, excellent adherence, and excellent heat resistance.
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Inventors:
Zen Akaharu
Application Number:
JP2018568217A
Publication Date:
April 15, 2020
Filing Date:
July 07, 2017
Export Citation:
Assignee:
CHANGZHOU TRONLY ADVANCED ELECTRONIC MATERIALS CO.,LTD.
CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS Co., Ltd.
CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS Co., Ltd.
International Classes:
C08F20/26; C07D305/06
Domestic Patent References:
| JP2011168561A |
Foreign References:
| WO2011062070A1 | ||||
| CN104447635A |
Attorney, Agent or Firm:
Seiji Okuda
Osamu Kita
Michi Kajitani
Ryoji Yamashita
Akiko Miyake
Osamu Kita
Michi Kajitani
Ryoji Yamashita
Akiko Miyake