Title:
ＩＣパッケージ
Document Type and Number:
Japanese Patent JP7303294
Kind Code:
B2
Abstract:
In a method for fabricating an integrated circuit (IC) package, one or more IC chips are stacked on a package substrate. A marking plate is formed on the one or more IC chips with a first major surface facing the one or more IC chips. A plastic structure is formed to encapsulate the one or more IC chips and the marking plate such that a second major surface of the marking plate is a portion of an outer surface of the IC package.
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| JP2005142351 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| JPH01295447 | MARKING APPARATUS FOR SEMICONDUCTOR DEVICE |
Inventors:
Elephant Houde
Chen Pen
Chen Pen
Application Number:
JP2021523013A
Publication Date:
July 04, 2023
Filing Date:
October 30, 2018
Export Citation:
Assignee:
Yangtze Memory Technologies Co.,Ltd.
International Classes:
H01L23/00; H01L23/28; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP2017168701A | ||||
| JP2014053538A | ||||
| JP2012009568A | ||||
| JP2003224234A | ||||
| JP2009267154A | ||||
| JP2012151172A | ||||
| JP2010514208A | ||||
| JP5063113A |
Foreign References:
| WO2018168391A1 | ||||
| US6238954 |
Attorney, Agent or Firm:
Hiromori Arai