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Title:
【発明の名称】溶融接着被覆層の帯電防止仕上げ方法
Document Type and Number:
Japanese Patent JP2618450
Kind Code:
B2
Abstract:
A process for the production of plastic mouldings provided with an antistatic hot-melt adhesive layer in which the hot-melt adhesive layer is coated with a solution containing a binder and an oxidant which is suitable for the oxidative polymerisation of 5- or 6-membered heterocyclic compounds containing nitrogen or sulphur as hetero atoms, and the resultant coating is treated with a solution of the 5- or 6-membered heterocyclic compounds.

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Inventors:
Friedrich Jonas
Berner Baldenrath
Application Number:
JP21642888A
Publication Date:
June 11, 1997
Filing Date:
September 01, 1988
Export Citation:
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Assignee:
Bayer Actien Gezershyaft
International Classes:
B32B7/12; B32B7/02; B32B27/18; C08G61/12; C08J7/043; C08J7/044; C08J7/052; C08J7/06; C09J7/22; C09J7/35; (IPC1-7): C08J7/06; B32B7/02; B32B7/12; B32B27/18; C08J7/04
Domestic Patent References:
JP61111336A
JP62136712A
Attorney, Agent or Firm:
Heiyoshi Odashima



 
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