Title:
【発明の名称】フリップチップデバイスのための熱再加工可能なバインダー
Document Type and Number:
Japanese Patent JP2001506805
Kind Code:
A
Abstract:
A semiconductor device is attached to a supporting substrate by a plurality of solder connections that extend from the supporting substrate to the semiconductor device and the gap between the supporting substrate and the semiconductor device is filled with a reworkable composition comprising: (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one filler present in an amount from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable semiconductor assembly.
Inventors:
Ia, Siridal Ratnaswami
Wuong, Piyu Kwan
Wuong, Piyu Kwan
Application Number:
JP52734498A
Publication Date:
May 22, 2001
Filing Date:
December 15, 1997
Export Citation:
Assignee:
Ciel International Research Mart Shats Pay BV
International Classes:
C08G67/02; H01B3/44; H01L21/56; H01L23/29; C08L73/00; H01L23/31; H05K3/34; (IPC1-7): H01L23/29; C08L73/00; H01L23/31
Attorney, Agent or Firm:
Yoshio Kawaguchi (2 outside)