Title:
【発明の名称】半導体封止用エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP3369323
Kind Code:
B2
Inventors:
Yasuyuki Murata
Norio Tsuiwa
Yoshinori Nakanishi
Norio Tsuiwa
Yoshinori Nakanishi
Application Number:
JP24342594A
Publication Date:
January 20, 2003
Filing Date:
September 13, 1994
Export Citation:
Assignee:
Japan Epoxy Resin Co., Ltd.
International Classes:
C08L63/00; C08G59/40; C08G59/62; C08K3/36; H01L23/29; H01L23/31; (IPC1-7): C08G59/40; C08G59/62; C08K3/36; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP6253327A | ||||
| JP61285214A | ||||
| JP61238817A | ||||
| JP4248828A |
Attorney, Agent or Firm:
Hideo Watanabe