Title:
CIRCUIT SUBSTRATE
Document Type and Number:
Japanese Patent JPH07115309
Kind Code:
A
Abstract:
PURPOSE: To provide a circuit substrate which can increase the electrodes area of a through hole to reduce the loss of electrical characteristic, can improve reliability of the connecting performance, and also can reduce the machining cost.
CONSTITUTION: When a circuit substrate 7 is constituted by forming electrodes 19a-19f in a pattern on both main faces of a substrate and connecting electrodes 19a-19f each other by a through hole electrode 18 formed on the substrate, a pattern of electrodes 19a-19f is formed over the cut lines C of a mother substrate 7a. Then the electrode 18 is formed on each line C, and the substrate 7a is cut along thse lines C.
More Like This:
| JP2004343273 | NONRECIPROCAL CIRCUIT ELEMENT |
| JPH01253301 | NON-REVERSIBLE CIRCUIT ELEMENT |
| JPH06343004 | NON-REVERSIBLE CIRCUIT ELEMENT |
Inventors:
DEJIMA HIROMOTO
ISHIURA YUTAKA
OKAMURA KEIJI
KAWANAMI TAKASHI
HASEGAWA TAKASHI
OHIRA KATSUYUKI
ISHIURA YUTAKA
OKAMURA KEIJI
KAWANAMI TAKASHI
HASEGAWA TAKASHI
OHIRA KATSUYUKI
Application Number:
JP25866493A
Publication Date:
May 02, 1995
Filing Date:
October 15, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01P1/383; H01P11/00; H05K3/00; H05K3/40; (IPC1-7): H01P1/383; H01P11/00
Attorney, Agent or Firm:
Tsutomu Shimoichi