Title:
【発明の名称】低分子量エチレン共重合体を含む改良されたホットメルト接着剤組成物
Document Type and Number:
Japanese Patent JP2620040
Kind Code:
B2
Abstract:
Hot melt adhesive compositions which include a base polymer constituent, a tackifying constituent, a wax constituent, and which further includes a low molecular weight polyethylene copolymer constituent which includes ketone functional moieties and/or hydroxyl functional moieties wherein the hot melt adhesive composition may be further characterized as providing improved adhesive strength to polar and non-polar substrates.
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Inventors:
Classel, Lawrence
Application Number:
JP51605793A
Publication Date:
June 11, 1997
Filing Date:
March 12, 1993
Export Citation:
Assignee:
Allied-Signal Incorporated
International Classes:
C09J123/02; C09J123/08; C09J129/04; C09J133/04; C09J133/08; C09J171/00; C09J173/00; C08L91/06; C08L93/04; C08L101/00; (IPC1-7): C09J123/08; C09J129/04; C09J133/08; C09J173/00
Domestic Patent References:
| JP3181557A | ||||
| JP578234A |
Attorney, Agent or Firm:
Kyozo Yuasa (6 people outside)