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Title:
THERMOIONIC ELEMENT AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0818109
Kind Code:
A
Abstract:

PURPOSE: To improve performance of a thermoionic element in a compact and thin configuration by embedding a part or the entire of a columnar thermoionic semiconductor material into insulating material such as resin, ceramics and glass.

CONSTITUTION: A plate-shaped or rod-shaped P-type semiconductor material 3 and an N-type thermoionic semiconductor material 4 are cut into a plurality of columnar shapes with a cutting device. Then, the columnar P-type thermoionic semiconductor material 3 and the N-type thermoionic material 4 are made to face. A part of or the entire part of the gap is filled with an insulating material 5 such as resin, ceramics and glass, and the parts are fixed. Then the surfaces of the columnar thermoionic semiconductor material 3 and the N-type thermoionic semiconductor material 4 are exposed. Finally, the P-type thermoionic semiconductor material 3 and the N-type thermoionic semiconductor material 4, a which are exposed on the surface, are connected with the conductive material such as metal. Thus, the P-N junction is formed.


Inventors:
KISHI MATSUO
ATAKA TATSUAKI
KUWABARA SEIJI
OKANO HIROSHI
NEMOTO HIROHIKO
Application Number:
JP14358294A
Publication Date:
January 19, 1996
Filing Date:
June 24, 1994
Export Citation:
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Assignee:
SEIKO INSTR INC
International Classes:
H01L35/14; H01L35/32; (IPC1-7): H01L35/32; H01L35/14
Attorney, Agent or Firm:
Keinosuke Hayashi (1 person outside)



 
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