METHOD OF PROVIDING PATTERNED RELIEF OF HARDENED PHOTORESIST ON FLAT SUBSTRATE SURFACE AND DEVICE THEREFOR

Title:

METHOD OF PROVIDING PATTERNED RELIEF OF HARDENED PHOTORESIST ON FLAT SUBSTRATE SURFACE AND DEVICE THEREFOR

Document Type and Number:

Japanese Patent JPH075693

Kind Code:

A

Abstract:

PURPOSE: To provide a method suitably used for seamlessly reproducing a relief pattern 10×10μm in size on a surface 1×1m in size.

CONSTITUTION: In a device for reproducing a patterned synthetic resin relief 37 on a surface 25 of a glass substrate 27, the substrate surface 25 is coated with an acrylate lacquer 33 that can be hardened by ultraviolet rays, and then a transparent mold 3 having relief 13 is rolled on the surface 25. The lacquer is hardened at a place of a focal line 23 by an ultraviolet ray source 17 and an elliptical mirror to form relief 37. The relief 13 of the mold 3 is reproduced on the glass substrate 27. By this method, small-sized relief (10×10μm) is formed seamlessly on a large flat surface (1×1m) without hindrance due to large peeling force.

Inventors:

HAISMA JAN (NL)
VERHEIJEN MARTINUS JOHANNES (NL)
SCHRAMA JOHANNES THOMAS (NL)

Application Number:

JP4585594A

Publication Date:

January 10, 1995

Filing Date:

March 16, 1994

Export Citation:

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Assignee:

KONINKL PHILIPS ELECTRONICS NV (NL)

International Classes:

G02B5/20; B29C35/08; B29C35/10; B29C39/14; G03F7/20; G09F3/02; H01L21/027; (IPC1-7): G03F7/20; G02B5/20; G09F3/02; H01L21/027

Attorney, Agent or Firm:

Akihide Sugimura (5 outside)

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