Title:
【発明の名称】多層のヒューズ付きマイクロ波伝導性構造体
Document Type and Number:
Japanese Patent JPH11504597
Kind Code:
A
Abstract:
A conductive structure for use in microwave food packaging which adapts itself to heat food articles in a safer, more uniform manner is disclosed. The structure includes a conductive layer disposed on a non-conductive substrate. Provision in the structure's conductive layer of fuse links and base areas causes microwave induced currents to be channeled through the fuse links, resulting in a controlled heating. When over-exposed to microwave energy, fuses break more readily than the conductive base areas resulting in less absorption of microwave energy in the area of fuse breaks than in other regions where fuses do not break. The arrangement and dimensions of fuse links compensate for known uneven stresses in the substrate, giving uniform fuse performance. In addition, by varying the dimensions of the fuse links and base areas it is possible to design and fabricate different fused microwave conductive structures having a wide range of heating characteristics. Thus, a fused microwave conductive structure permits food heating temperatures to be tuned for food type.
Inventors:
Glenn Jay, Walters
McCormick, John A.
McCormick, John A.
Application Number:
JP53339396A
Publication Date:
April 27, 1999
Filing Date:
April 29, 1996
Export Citation:
Assignee:
Advanced Deposition Techniques Incorporated
International Classes:
A23L5/10; A47J27/00; B32B7/02; B65D81/34; F24C7/02; (IPC1-7): B65D81/34
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)