Title:
【発明の名称】混成積層回路装置及び混成積層回路部品
Document Type and Number:
Japanese Patent JP2892089
Kind Code:
B2
Abstract:
PURPOSE:To prevent a hybrid laminated circuit device from changing in temperature characteristics due to heat release by a method wherein a cavity induced by a level difference between a hybrid laminated circuit component and a board is filled with a thermal conductor. CONSTITUTION:A capacitor layer 2 is structured in such a manner that capacitor networks 21-27 are buried in a dielectric porcelain 20, and the capacitor networks 21-27 are constituted through such a way that capacitors formed by making electrodes opposed to each other through the intermediary of a dielectric porcelain layer are so connected to constitute required capacitor circuits, where the capacitor networks 21-27 are connected to either of connection terminals 5 to lead outside. A level difference G1 equal to the thickness of the terminal 5 is induced between the connection terminal 5 and a coil layer 1 of the laminated passive composite body. The cavity formed between a board 8 and the coil layer 1 of the laminated passive composite body due to the level difference G1 is filled with a thermal conductor 6 which is formed of electrical conductor material such as metal or resin material excellent in thermal conductivity such as silicone compound.
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Inventors:
TAKATANI MINORU
YASUDA KATSUHARU
YASUDA KATSUHARU
Application Number:
JP6575590A
Publication Date:
May 17, 1999
Filing Date:
March 16, 1990
Export Citation:
Assignee:
TEII DEII KEI KK
International Classes:
H05K1/18; H01F27/00; H01G4/40; H01L25/00; H05K3/46; H05K1/00; H05K1/02; H05K1/03; H05K1/14; H05K1/16; H05K3/34; (IPC1-7): H05K1/18; H01F27/00; H01G4/40
Domestic Patent References:
| JP6412510A | ||||
| JP6196567U | ||||
| JP1139420U |
Attorney, Agent or Firm:
Abe Mijiro