PURPOSE: To obtain a small and high-efficiency boiling and cooling apparatus by a method wherein flat tubes with reference to a cooling tank are constituted so as to become an integral airtight structure in the vertical direction, and a cooling fin is installed between the tubes.
CONSTITUTION: A semiconductor element 70 to be cooled is mounted in a cooling tank 20 made of a rolled steel plate, and a fluorocarbon-based coolant 60 in a quantity which is sufficient to immerse the semiconductor element 70 is poured. A plurality of airtight terminals 50 are attached to the wall face of the cooling tank 20, and they are wired to the semiconductor element 70. An aluminum tube 102 whose cross section is flat is attached to the upper part of the cooling tank 20 by directing its opening face downward in such a way that it forms an integral airtight structure in the vertical direction with reference to the cooling tank 20. An aluminum corrugated fins 101 are connected to the side face of the cooling tank 20, and a heat exchanger 1 is formed.
KAWAGUCHI SEIJI
SUZUKI MANJI
FURUKAWA TAKASHI
SUZUKI MASAHIKO
CHIYOUGABE HIROYUKI
