Title:
【発明の名称】配線回路基盤用樹脂製電気絶縁基材及びその製造方法
Document Type and Number:
Japanese Patent JP2712256
Kind Code:
B2
Abstract:
A plastic electrically insulating substrate, having high thermal conductivity, for wiring circuit boards including a substrate having a front surface for mounting an electrical device back surface. The substrate is made of a laminate of a plurality of oriented sheets of one or more semicrystalline polymers having a uniform oriented direction of the sheets, and wherein the oriented direction of the sheets is arranged in the direction of the substrate thickness.
Inventors:
Shinji Nezu
Application Number:
JP7688488A
Publication Date:
February 10, 1998
Filing Date:
March 30, 1988
Export Citation:
Assignee:
Aisin Seiki Co., Ltd.
International Classes:
H01B19/00; H01B17/60; H01L23/14; H01L23/373; H05K1/03; H05K1/05; H05K3/00; (IPC1-7): H05K1/03