Title:
【発明の名称】半導体チップのアライメント方法およびレーザ修理用ターゲット
Document Type and Number:
Japanese Patent JP2802561
Kind Code:
B2
Abstract:
A method for aligning a semiconductor chip to be repaired with a repair system and a laser repair target used therefor, The laser repair target comprises at least one basic target adapted to be used in focusing, X-alignment and Y-alignment and shaped into a right-angled triangle and at least one bar type target adapted to be used in Theta-alignment. The laser repair target has selected targets at corners thereof, respectively. Offsets in X-direction and Y-direction are calculated on the basis of respective differences in X-coordinate and Y-coordinate between center X- and Y-coordinates and X- and Y-coordinates in actual scanning. It is possible to reduce the time required for the alignment of semiconductor chip to be repaired, thereby improving the productivity of semiconductor chips and reducing the total area of each semiconductor chip.
Inventors:
Korea
Application Number:
JP8879292A
Publication Date:
September 24, 1998
Filing Date:
April 09, 1992
Export Citation:
Assignee:
EL G SEMICON Company Limited
International Classes:
H01L21/66; H01L21/68; H01L21/82; H01S3/00; H01L21/02; H05K13/04; H05K13/08; (IPC1-7): H01L21/68; H01L21/02; H01L21/66; H01L21/82
Domestic Patent References:
| JP55162229A | ||||
| JP62193124A | ||||
| JP57192028A | ||||
| JP61258420A |
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)