Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3339552
Kind Code:
B2
Inventors:
Yuji Takayanagi
Hiromi Hosoya
Tobiyama Yoshiro
Junichiro Horiuchi
Tatsuhiro Seki
Hiromi Hosoya
Tobiyama Yoshiro
Junichiro Horiuchi
Tatsuhiro Seki
Application Number:
JP31646296A
Publication Date:
October 28, 2002
Filing Date:
November 27, 1996
Export Citation:
Assignee:
株式会社日立製作所
日立原町電子工業株式会社
日立原町電子工業株式会社
International Classes:
H01L29/41; H01L29/45; H01L29/68; H01L29/739; H01L29/78; (IPC1-7): H01L29/41; H01L29/68; H01L29/78
Domestic Patent References:
| JP53121571A | ||||
| JP63313839A | ||||
| JP629288A | ||||
| JP6135565A | ||||
| JP4724768A | ||||
| JP5240688Y1 |
Attorney, Agent or Firm:
Kiyoshi Maruyama (5 others)