Title:
【発明の名称】半導体パッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP2762418
Kind Code:
B2
Inventors:
IWASE HIDEHIRO
HABATA KEIICHI
HABATA KEIICHI
Application Number:
JP22167288A
Publication Date:
June 04, 1998
Filing Date:
September 05, 1988
Export Citation:
Assignee:
TOSHIBA KEMIKARU KK
International Classes:
H01L23/28; H01L21/56; H01L23/08; (IPC1-7): H01L23/28; H01L21/56; H01L23/08
Domestic Patent References:
| JP1232752A | ||||
| JP62120053A | ||||
| JP63152156A |
Attorney, Agent or Firm:
Eiji Morota