Title:
MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH07115273
Kind Code:
A
Abstract:
PURPOSE: To embody a more enhanced fine pattern by reducing the size of a via hole and further reducing circuit widths or circuit clearances and propose a multilayer printed wiring board based on an additive process forming a high reliability connection via hole as well.
CONSTITUTION: In a multilayer printed wiring board where a conductor layer formed by way of a resin insulation layer based on an additive process is laminated, a lower layer which comprises the resin insulation layer is made of a ceramic-contained resin layer and an upper layer of the resin insulation layer is a multilayer printed wiring board which is an electroless plating adhesive layer.
Inventors:
ENOMOTO AKIRA
SUZUKI AYUMI
TAKASAKI YOSHINORI
SUZUKI AYUMI
TAKASAKI YOSHINORI
Application Number:
JP28598093A
Publication Date:
May 02, 1995
Filing Date:
October 19, 1993
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; (IPC1-7): H05K3/46