Title:
【発明の名称】はんだ付検査装置
Document Type and Number:
Japanese Patent JP3061952
Kind Code:
B2
Abstract:
PURPOSE:To provide a method which estimates the three-dimensional shape of a solder zone and also stably inspects even variation in the quantity of reflected light. CONSTITUTION:This soldering inspecting device has plural ring-shaped lighting parts 3 which have different elevation angles to a mounted component 2 on a printed circuit board 1 and have the same center axis, an image pickup part 4 which is arranged facedown perpendicularly on the center axis, a lighting control part 5 which performs ON/OFF control over the lighting parts 3 by the elevation angles, and an A/D conversion part 6 which digitizes an analog image signal generated by the image pickup part 4. Further, this device has a memory 7 which stores the digitized image signal, an image processing part 8 which classifies a soldering surface angle according to the large/small relation among the image signals digitized by the elevation angles, a decision part 9 which decides whether a soldering state is good or not according to the soldering surface angle, an XY table 10 which moves the printed circuit board 1 onto a surface containing the center axis of the ring-shaped lighting parts 3 as a normal direction, an XY table control part 11 which controls the positioning of the XY table 10, and a CPU 12 which performs total control over the whole device.
Inventors:
Masayoshi Kimura
Katsuyoshi Sasaki
Katsuyoshi Sasaki
Application Number:
JP23445092A
Publication Date:
July 10, 2000
Filing Date:
September 02, 1992
Export Citation:
Assignee:
NEC
Tohoku NEC Corporation
Tohoku NEC Corporation
International Classes:
H05K3/34; G06T1/00; G06T7/00; (IPC1-7): G06T7/00; G06T1/00
Domestic Patent References:
| JP4346011A |
Attorney, Agent or Firm:
Naoki Kyomoto