Title:
【発明の名称】板状熱交換器の無溶媒成形方法
Document Type and Number:
Japanese Patent JP2002504870
Kind Code:
A
Abstract:
A method for forming thermoplastic heat exchanger panels without using solvents, wherein a co-extruded film is used to provide a layer of toughened, heat-sealable nylon on a layer of regular nylon, and using such panels in a gas-assisted press bonding process to form the heat exchanger panels.
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Inventors:
Dossi, Sheresh.
Farcus, Nicholas.
Stevens, Kenneth, Earl.
Farcus, Nicholas.
Stevens, Kenneth, Earl.
Application Number:
JP50119999A
Publication Date:
February 12, 2002
Filing Date:
June 05, 1998
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
B29C49/00; B29C49/02; B29C51/02; B29C69/00; B32B27/34; C08G81/00; C08L77/00; F28F21/06; (IPC1-7): B29C51/02; C08G81/00; C08L77/00; F28F21/06
Attorney, Agent or Firm:
Yoshikazu Tani (2 outside)