Title:
WIRING STRUCTURE
Document Type and Number:
Japanese Patent JPH0745611
Kind Code:
A
Abstract:
PURPOSE: To increase the strength against electromigration in a multilayer wiring of Al and CVDW.
CONSTITUTION: The aluminum film 14 is formed by sputtering over the CVDW film, and is caused to reflow thereby making the surface of the aluminum flat. Thereafter, the conductive layer 15 of titanium, titanium nitride, or tungsten titanate, and the aluminum film 16 are formed by sputtering, and the wiring is formed by standard micromachining.
Inventors:
YAMAZAKI KOJI
Application Number:
JP18456293A
Publication Date:
February 14, 1995
Filing Date:
July 27, 1993
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/28; H01L21/3205; H01L23/52; (IPC1-7): H01L21/3205; H01L21/28
Domestic Patent References:
| JPH0472733A | 1992-03-06 | |||
| JPS60202953A | 1985-10-14 |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
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