Title:
【発明の名称】チップ型電子部品包装用カバーテープ
Document Type and Number:
Japanese Patent JP2901857
Kind Code:
B2
Inventors:
NAKANISHI HISAO
Application Number:
JP31771993A
Publication Date:
June 07, 1999
Filing Date:
December 17, 1993
Export Citation:
Assignee:
SUMITOMO BEEKURAITO KK
International Classes:
B65D73/02; B32B9/04; B32B27/00; C09J7/02; C09J123/04; C09J123/08; C09J131/04; H01L23/28; (IPC1-7): B65D73/02; B32B9/04; B32B27/00; H01L23/28