Title:
ELECTRONIC PACKAGE ASSEMBLY
Document Type and Number:
Japanese Patent JPH0629101
Kind Code:
A
Abstract:
PURPOSE: To provide an electronic component packaging assembly which can have high thermal conductivity ability, can disperse a large peak power surge without deteriorations, and can be easily assembled with a low package-base failure rate. CONSTITUTION: A package comprises an electrically insulating thick base 116. A cover 100 is provided with recesses 102 for accepting electronic components 108 and springs 106 for thermally tightly pushing the components 108 against the base. The cover 100 slides along engaging rails 118 and 120 into a predetermined position of the base 116, where the cover maintains a required pushing force.
Inventors:
JIEEMUZU KAARUTON GOODON
ERITSUKU POORU RABUGUREN
HAAMAN POORU MEIYAA
DONARUDO POORU RIIRITSUKU
ERITSUKU POORU RABUGUREN
HAAMAN POORU MEIYAA
DONARUDO POORU RIIRITSUKU
Application Number:
JP23380491A
Publication Date:
February 04, 1994
Filing Date:
August 22, 1991
Export Citation:
Assignee:
IBM
International Classes:
H01C1/02; H01C1/08; H01C1/084; (IPC1-7): H01C1/02; H01C1/08
Domestic Patent References:
| JPH01154602U | 1989-10-24 | |||
| JPS52132779A | 1977-11-07 |
Attorney, Agent or Firm:
Koichi Tonmiya (4 outside)
Next Patent: CHIP RESISTOR AND ITS MANUFACTURING METHOD