Title:
RESIN SEALING EQUIPMENT FOR SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0729928
Kind Code:
A
Abstract:
PURPOSE: To prevent plating fusion of a semiconductor device which is previously subjected to sheath plating, and plating transfer to a metal mold.
CONSTITUTION: A material layer having heat resistance is formed on the surface of the lead frame clamp parts of resin sealing metal molds 1A, 1B, thin holes for cooling are arranged inside the lead frame clamp parts, and refrigerant is made to flow continuously through a piping 6 with a pump 4. Thereby transfer to the metal mold of a semiconductor device which is previously subjected to sheath plating can be prevented, and at the same time deterioration of reliability of a semiconductor device due to plating fusion can be prevented.
Inventors:
TAKAHASHI HIDEAKI
Application Number:
JP16896593A
Publication Date:
January 31, 1995
Filing Date:
July 08, 1993
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/56; (IPC1-7): H01L21/56
Domestic Patent References:
| JPH05175263A | 1993-07-13 | |||
| JPH02265721A | 1990-10-30 |
Attorney, Agent or Firm:
Wakabayashi Tadashi