Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
【発明の名称】薄板型基板のための移送装置
Document Type and Number:
Japanese Patent JP2002510432
Kind Code:
A
Abstract:
The present invention is directed to a transport apparatus for thin, board-shaped substrates, for example printed circuit boards, which are conveyed through a coating installation and the like. In order to simplify manipulation during conveying, there is provided a frame (1) for holding a substrate (7), tensioning elements (4) being arranged spaced from one another on frame members (2), lying opposite one another, of the frame (1), which tensioning elements (4) engage the edge of the substrate and tension the substrate, the frame (1) being provided with a device (16) which serves to provide connection to a conveyor belt or the like. The tension springs (4) exert a tension away from the substrate (7) in the direction of the plane of the thin substrate to avoid sagging of the substrate. FIG. (1) illustrates the transport apparatus.

Inventors:
Anton Ruge
Gerhard Craft
Toasten Replicate
Caspar Custer
Application Number:
JP53808998A
Publication Date:
April 02, 2002
Filing Date:
January 15, 1998
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Buntico Actien Gezel Shaft
International Classes:
H05K3/34; H05K13/00; H05K13/02; (IPC1-7): H05K13/02; H05K3/34
Attorney, Agent or Firm:
Nobuo Kaida (3 outside)