Title:
【発明の名称】化学的バフ磨き中の終点検出のためのゼータ電位の使用
Document Type and Number:
Japanese Patent JP2002528928
Kind Code:
A
Abstract:
A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next. In order to ensure that there is a noticeable difference in the shear force variation at the polishing end point, a slurry having a particular pH level is selected. The pH level ensures that the zeta potential changes noticeably from one material to the next, so as to induce a change in the shear force, which is detected by a change in the fluid pressure.
Inventors:
Classel wilberty
Nagengast Andrew Jay
Pant Anil Kay
Nagengast Andrew Jay
Pant Anil Kay
Application Number:
JP2000579404A
Publication Date:
September 03, 2002
Filing Date:
October 13, 1999
Export Citation:
Assignee:
Rum Research Corporation
International Classes:
B24B21/08; B24B37/013; B24B49/16; H01L21/304; H01L21/306; H01L21/321; G01N1/32; H01L21/768; (IPC1-7): H01L21/304; B24B37/04; H01L21/306
Attorney, Agent or Firm:
Minoru Nakamura (10 outside)