Title:
【発明の名称】ウェーハ研磨方法および装置
Document Type and Number:
Japanese Patent JPH09506213
Kind Code:
A
Abstract:
A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantially simultaneously loaded into the plurality of wafer carriers by wafer holding apparatus of an index table. Similarly, a plurality of polished wafers are substantially simultaneously unloaded from the plurality of wafer carriers into wafer holding apparatus of the index table. The wafer carriers are individually computer controlled for exact polishing and different polishing requirements can be met at the same time by different wafer carriers.
Inventors:
Carlslad Chris Yee
Van Vocom Antony Gee
Odagiri Sigel
Nagahisa Isao
Pulhuston Spencer
Van Vocom Antony Gee
Odagiri Sigel
Nagahisa Isao
Pulhuston Spencer
Application Number:
JP50499296A
Publication Date:
June 17, 1997
Filing Date:
February 08, 1995
Export Citation:
Assignee:
Speedfam Corporation
International Classes:
B24B37/08; B24B37/34; B24B49/16; B24B51/00; G05B19/418; H01L21/304; H01L21/677; H01L21/683; (IPC1-7): H01L21/304; B24B37/04
Attorney, Agent or Firm:
Minoru Nakamura (6 outside)