PURPOSE: To eliminate a need for a circuit board which processes an output signal by a method wherein a circuit which signal-processes an output signal from a solid-state image pickup element is installed in a package which fixes the element.

CONSTITUTION: A prescribed circuit pattern 6 is formed on the lower side face of a ceramic board 2a. An overcoat 12 is formed on it; lands for prescribed component mounting use are formed. Active components such as transistors, FETs and the like and a circuit components 7 such as a large-capacitance capacitor or the like are soldered and mounted. Input pins 5 are installed from the side on which a CCD chip is not installed in a package 2, e.g. from the ceramic board 2a; video signals which perform the prescribed signal processing operation of output signals are taken out from the CCD chip 1. Consequently, it is possible to eliminate a circuit board which signal-processes the output signals of the CCD chip 1.