Title:
【発明の名称】小麦粉およびパン用小麦粉組成物
Document Type and Number:
Japanese Patent JP2688516
Kind Code:
B2
Abstract:
There is disclosed a wheat flour comprising not less than 60% by weight of flours which pass through a screening surface having an opening of 75 microns and remain on a screening surface having an opening of 38 microns, which is suitable for the manufacture of a bread, a pasta and noodle. Also disclosed is a wheat flour composite for breadstuff wherein the wheat flour is compounded with a thicker and optionally a malt. The wheat flour composite is suitable for the manufacture of a high quality bread having good appearance, good textural and taste characteristics.
Inventors:
Yutaka Otsubo
Takaya Teru
Takaya Teru
Application Number:
JP1977689A
Publication Date:
December 10, 1997
Filing Date:
January 31, 1989
Export Citation:
Assignee:
NISSHIN FLOUR MILLING CO.,LTD.
International Classes:
A23L7/10; A21D2/00; A21D2/18; A21D2/26; A21D2/36; A21D2/38; A21D6/00; B02C9/00; B07B1/46; B07B1/55; (IPC1-7): A21D2/00; A21D2/18; A21D2/38; A23L1/10
Attorney, Agent or Firm:
Chika Takagi (2 outside)