Title:
【発明の名称】ワイヤボンディング装置および方法
Document Type and Number:
Japanese Patent JP2504154
Kind Code:
B2
Abstract:
PURPOSE:To facilitate a modification of the number of bondings by a method wherein a wire bonding device is constituted in such a way that one bonding point is controlled on the basis of one line in wire bonding control data. CONSTITUTION:In case the number of bondings and the number of total bondings are respectively assumed to be (n) and (m), the (n) is initialized to n=1 and thereafter, nth-line data is read out from wire bonding control data. Then, a wire bonding device is moved to a first point using read-out positional information Pn-1, executes a bonding at the first point on the basis of control information Bn-1 to execute a wire bonding start treatment and forms a first bonding 26 to perform a control at the time of start of wire bonding. Then, while executing a loop control to form a first loop 27 on the basis of positional information Pn-2, the device is moved to a second point and executes a second bonding 28 on the basis of control information Bn-2 to perform a control at the time of continuation of wire bonding. Then, while executing a loop control to form a second loop 29 on the basis of positional information Pn-3, the device is moved to a third point and executes a bonding at the third point on the basis of control information Bn-3 to perform a wire bonding end treatment. Thereby, when the number of bondings per wire is modified, a modification of a matrix structure consisting of data becomes unnecessary.
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Inventors:
SHIMOBAYASHI MASARU
Application Number:
JP617389A
Publication Date:
June 05, 1996
Filing Date:
January 12, 1989
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP57112035A | ||||
| JP6353940A | ||||
| JP1160027A | ||||
| JP1246840A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)