Title:
【発明の名称】半導体デバイス用の、有機残留物およびプラズマエッチングされた残留物を洗浄するための組成物
Document Type and Number:
Japanese Patent JP2002543272
Kind Code:
A
Abstract:
A composition for the cleaning of residues from substrates from about 0.01 percent by weight to about 5 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by weight to about 80 percent by weight of an organic amide solvent and from 0 to about 50 weight percent of an organic sulfoxide solvent. The composition has a pH between about 7 and about 10. Additionally, the composition optionally contains corrosion inhibitors, chelating agents, surfactants, acids and bases. In use of the composition, a substrate is contacted with the composition for a time and at a temperature that permits cleaning of the substrate.
Inventors:
Small, Robert, Jay.
Chen, Jun
Moo, Taishin
Chen, Jun
Moo, Taishin
Application Number:
JP2000615722A
Publication Date:
December 17, 2002
Filing Date:
May 02, 2000
Export Citation:
Assignee:
EK Technology, Incorporated
International Classes:
C11D7/10; C11D3/04; C11D3/30; C11D3/32; C11D3/43; C11D7/32; C11D7/34; C11D7/50; C11D11/00; G03F7/42; H01L21/02; (IPC1-7): C11D7/10; C11D3/04; C11D3/30; C11D3/32; C11D7/32; C11D7/34; C11D7/50
Domestic Patent References:
| JPH1167632A | 1999-03-09 | |||
| JPH11119444A | 1999-04-30 | |||
| JPH1116882A | 1999-01-22 | |||
| JPH09246222A | 1997-09-19 | |||
| JP2000181083A | 2000-06-30 |
Attorney, Agent or Firm:
Junko Kobayashi (5 others)