Title:
【発明の名称】チップと完全に包囲された接続手段と、を有するデータ保持器
Document Type and Number:
Japanese Patent JP2002533915
Kind Code:
A
Abstract:
The data carrier (4) of a device (1) provided with a data carrier (4) includes a casing (5) which is formed by injection molding and in which there are accommodated holding means (6) for holding a chip (7) and at least one transmission coil (8), and also includes electrically conductive connection means (16) which are connected to the holding means (6) and are arranged to connect the chip terminals (9, 10) of the chip (7) to the coil terminals (11, 12) of the transmission coil (8); the holding means (6) include a holding foil (17) and the connection means (16) are realized while utilizing a conductor frame (18) and are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) of the conductor frame (18) and are completely enclosed by the casing (5), at least parts of said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) being connected to the holding foil (17) in order to hold said conductor segments.
Inventors:
Marcus, Toss
Wolfgang, Shoeshire
Geralt, Shuffler
Heinz, Kvass
Wolfgang, Shoeshire
Geralt, Shuffler
Heinz, Kvass
Application Number:
JP2000590101A
Publication Date:
October 08, 2002
Filing Date:
December 13, 1999
Export Citation:
Assignee:
Konin Krekka Philips Electronics NV
International Classes:
G06K19/077; G07C9/00; H01L23/00; H01L23/08; H01L23/14; H01L23/50; H01L25/00; E05B19/00; (IPC1-7): H01L23/50; G06K19/077; H01L23/00; H01L23/08; H01L23/14; H01L25/00
Attorney, Agent or Firm:
Kazuo Sato (3 others)