Title:
【発明の名称】プラズマ処理チャンバへ安定した電力を送ることができる装置及び方法
Document Type and Number:
Japanese Patent JP2001514444
Kind Code:
A
Abstract:
An assembly for allowing stable power transmission into a plasma processing chamber comprising a dielectric member; and at least one material deposition support assembly secured to the dielectric member for receiving and supporting the deposition of materials during processing of a substrate and a chamber having a controlled environment and containing a plasma of a processing gas. A plasma reactor for processing substrates having a reactor chamber including a chamber sidewall and a dielectric window supported by the chamber sidewall. A plurality of deposition support members is coupled to an inside surface of the dielectric window for receiving and supporting a deposition of materials during processing of substrates. In an alternative embodiment of the invention, the plurality of deposition support members is connected to a liner assembly instead of to the dielectric window. The liner assembly is supported by the chamber sidewall. A pedestal is disposed in the reactor chamber for supporting substrates, such as semiconductor wafers, in the reacting chamber. The plasma reactor also includes a processing power source, a processing power gas-introducing assembly for introducing processing gas into the reactor chamber, and a processing power-transmitting member for transmitting power into the reactor interior to aid in sustaining a plasma from the processing gas within the reacting chamber. A method for adjusting the density of plasma contained in a chamber wherein substrates are to be processed. A method of processing (e.g. etching or depositing) a metal layer disposed on a substrate.
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Inventors:
Hwang, Jean, H.
Mack, Steve, S. Wye.
Yi, Yang
Mack, Steve, S. Wye.
Yi, Yang
Application Number:
JP2000508131A
Publication Date:
September 11, 2001
Filing Date:
August 14, 1998
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C23C16/505; C23C16/511; H01J37/32; H01L21/302; C23C14/54; (IPC1-7): H01L21/3065; C23C14/54; C23C16/505; H01J37/32
Attorney, Agent or Firm:
Yoshiki Hasegawa (2 outside)