Title:
【発明の名称】表面処理のためのモジュラ電子ビームシステムに関する装置および方法
Document Type and Number:
Japanese Patent JP2001527691
Kind Code:
A
Abstract:
A modular electron beam device is disclosed, the device being housed in a modular enclosure containing a power supply subsystem coupled to provide power to an electron beam tube. The enclosure is shaped to permit stacking of plural such modular units in a way that the stripe-shaped beam emitted from each of the units completely irradiates a surface to be treated. Beams may lie on different lines but the combined beams sweep out a width on a surface which is a continuous span. In an alternate embodiment of the invention, the modular unit comprises a plurality of electron beam units, each comprising an electron tube and a filament and bias supply to power the tube. A single high voltage stack is common to the plural tube/filament/bias sub-units. A daisy-chain arrangement allows for the single high voltage stack to power all of the tube units. In yet another embodiment, the modular unit comprises a plurality of electron tubes powered by a single power supply.
Inventors:
Wakalopros, George
Application Number:
JP54611198A
Publication Date:
December 25, 2001
Filing Date:
April 10, 1998
Export Citation:
Assignee:
American International Technologies, Inc.
International Classes:
H01J37/06; B29C71/04; G21K5/04; H01J5/18; H01J33/00; H01J33/04; H01J37/065; H01J37/30; B29C35/08; (IPC1-7): H01J37/065
Attorney, Agent or Firm:
Fukami Hisaro (5 others)