Title:
【発明の名称】フリップチップ接続を形成するためのボールまたはプリホームを供給する装置
Document Type and Number:
Japanese Patent JP2002528912
Kind Code:
A
Abstract:
A device (14) for implementing a method for setting on a substrate (2) interconnecting balls or preforms (1) comprising the following phases: storing in bulk the preforms (1); seizing in ordered position the preforms (1) with an adapted gripping device (9); setting the preforms (1) on the substrate (2) with the gripping device (9). Said device (14) is charaterized in that it consists of at least a matrix for storing the preforms, said matrix comprising a floor capable of acting as stop for the preforms when the matrix is being filled thereby enabling the implementation of a method whereby the passage from bulk storage to ordered storage is performed in masked time. The device is useful for incorporating or replacing balls in substrates of electronic components.
Inventors:
Buller, francis
Kaisel, Clement
Kaisel, Clement
Application Number:
JP2000578846A
Publication Date:
September 03, 2002
Filing Date:
October 27, 1999
Export Citation:
Assignee:
Novateques.a.
International Classes:
H01L21/48; H01L21/60; H01L21/68; H05K3/34; B23K3/06; (IPC1-7): H05K3/34; B23K3/06; H01L21/60
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)