Title:
【発明の名称】表面模様付高分子材料製造用エンボシング組成物
Document Type and Number:
Japanese Patent JP2550193
Kind Code:
B2
Abstract:
A water-based embossing composition for use in chemically embossing a foamable polymeric material having a blowing agent incorporated therein comprising: (A) a film-forming resin dissolved or dispersed in said aqueous composition; (B) a modifier which is effective in modifying the activity of the blowing agent comprising particulate solids which are substantially insoluble and uniformly dispersible in the liquid medium of the embossing composition and which have an average particle size of no greater than about 100 microns, said modifier being present in the composition in an amount of at least about 3 wt. %; and (C) optionally, a colorant or a softening agent for the modifier solids or a mixture thereof.
Inventors:
FURITSUSHU RUDORUFU
Application Number:
JP50054288A
Publication Date:
November 06, 1996
Filing Date:
November 09, 1988
Export Citation:
Assignee:
KONGORYUUMU CORP
International Classes:
B29C44/00; C08J9/04; C08J9/06; C08J9/10; D06N7/00; B29K105/04; C08J; (IPC1-7): B29C44/00; C08J9/06
Attorney, Agent or Firm:
Minoru Nakamura (7 outside)