Title:
【発明の名称】基板を熱処理するための反応室に一体化された加熱および冷却装置
Document Type and Number:
Japanese Patent JP2002541428
Kind Code:
A
Abstract:
A heating and cooling device for a substrate (14), comprising an electric heating resistor(16) which is integrated into notches (18) in the plate (12) with an inner covering (22) exhibiting good thermal conductivity placed therebetween. A cooling box (26) is arranged opposite the plate (12) and can be displaced between a first position that is spaced by means of a gap (32) in the lower surface of the plate (12) during the heating phase when the resistor (16) is supplied with power and a second near position when it comes into contact with the lower surface during cooling of the plate (12). The cooling box (26) is provided with a superficial sheet (30) of compressible material exhibiting good thermal conductivity to ensure homogeneous thermal contact with the lower surface of the plate (12). The notches(18) of the plate (12) are separated from each other by intermediate transverse members (20) that are used as calorific transfer means when the cooling box (26) is in the second near position. The invention can be used in thermal treatments of substrates or samples.
Inventors:
Pierre, Ducre
Herve, Guillon
Herve, Guillon
Application Number:
JP2000611309A
Publication Date:
December 03, 2002
Filing Date:
April 12, 2000
Export Citation:
Assignee:
JOINT INDUSTRIAL PROCESSORS FOR ELECTRONICS
International Classes:
H05B3/68; F27D9/00; F27D11/00; F27D11/02; H01L21/00; H01L21/26; (IPC1-7): F27D11/02; F27D9/00; F27D11/00; H01L21/26; H05B3/68
Attorney, Agent or Firm:
Kenji Yoshitake (4 others)