Title:
【発明の名称】液晶ポリマーテープの接着方法、およびリードフレームへの半導体チップの搭載方法
Document Type and Number:
Japanese Patent JP3384357
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To avoid increase of a linear expansion coefficient of liquid crystal polymer tape and also to avoid generation of air gaps in a bonded part of the tape. SOLUTION: Upon mounting a semiconductor chip 5 to a lead frame 1 having a hot melt type liquid crystal polymer tape 7 on its surface, only the tape 5 of both is heated to a liquid crystal transition temperature of the tape 7, and the heated chip 5 is brought into contact with the tape 7. Thereby only a surface area A of the tape 7 is heated to the liquid crystal transition temperature, and the chip 5 is bonded by the area A.
Inventors:
Kenichi Chiba
Application Number:
JP10482299A
Publication Date:
March 10, 2003
Filing Date:
April 13, 1999
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
H01L21/52; C09J7/00; C09J167/03; C09J177/10; C09J179/08; (IPC1-7): H01L21/52
Domestic Patent References:
| JP6104297A | ||||
| JP61194732A | ||||
| JP11265968A | ||||
| JP11307686A |
Attorney, Agent or Firm:
Tadao Hirata