Title:
【発明の名称】低変形温度を有する変形し得る材料の接着方法および装置
Document Type and Number:
Japanese Patent JP2001522915
Kind Code:
A
Abstract:
Systems, methods and apparatus are disclosed for bonding a plurality of substrates via a solventless, curable adhesive. At least one of the substrates has a deformation temperature below the activation temperature of the adhesive. A workpiece is assembled from a plurality of substrates with the curable adhesive disposed therebetween. Pressure is applied to the workpiece and the workpiece is irradiated with variable frequency microwave energy. The workpiece is swept with at least one window of microwave frequencies selected to heat the adhesive without heating the substrates above their respective deformation temperatures.
Inventors:
Kilgore, Bruce Jay
McKnight, Thomas
Omojandro, Roy Lin
Batista, John A., Jr.
Petrucci, richard jay
McKnight, Thomas
Omojandro, Roy Lin
Batista, John A., Jr.
Petrucci, richard jay
Application Number:
JP2000520501A
Publication Date:
November 20, 2001
Filing Date:
November 06, 1998
Export Citation:
Assignee:
Nike Inc
International Classes:
A43B9/12; A43D25/20; B29C65/00; B29C65/14; B29C65/48; B29C65/78; C08J5/12; B30B5/02; C08J7/00; C09J5/06; C09J201/00; (IPC1-7): C09J5/06; B29C65/14; B29C65/48; C08J5/12; C08J7/00; C09J201/00
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)