【発明の名称】積層体をレーザー穿孔する方法及び装置

Title:

【発明の名称】積層体をレーザー穿孔する方法及び装置

Document Type and Number:

Japanese Patent JP2003511240

Kind Code:

A

Abstract:

A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency>=30 kHz for the metal layer and >=20 kHz for the dielectric layer, and wavelength=532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.

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Inventors:

Joseph Van Pim Break
Marcel Haleman
Hubert de Stour

Application Number:

JP2001528441A

Publication Date:

March 25, 2003

Filing Date:

September 29, 2000

Export Citation:

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Assignee:

Siemens Aktiengesellschaft

International Classes:

B23K26/00; B23K26/40; B23K26/402; H05K3/00; B23K101/42; (IPC1-7): B23K26/00; B23K26/04; H05K3/00

Domestic Patent References:

JPH11103149A	1999-04-13
JPH0995657A	1997-04-08
JPH0760475A	1995-03-07
JPH05237686A	1993-09-17

Attorney, Agent or Firm:

Toshio Yano (4 outside)

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