Title:
【発明の名称】ホットメルト接着剤を製造する方法および装置
Document Type and Number:
Japanese Patent JP2001527491
Kind Code:
A
Abstract:
A method for packaging a hot melt adhesive mass comprises providing a hot melt adhesive having a predetermined viscosity and finite size and shape, and encapsulating the hot melt adhesive in a polymeric shrink wrap which forms a hermetic seal thereon. An packaged adhesive mass comprises a hot melt adhesive having a predetermined viscosity and a finite size and shape; and a polymeric shrink wrap film which encapsulates the hot melt adhesive. The hot melt adhesive is hermetically sealed.
Inventors:
Waver, Bruce A.
Meckling, David E
Hickman, Berkeley S
Bill Dusas, Leon
Meckling, David E
Hickman, Berkeley S
Bill Dusas, Leon
Application Number:
JP54449198A
Publication Date:
December 25, 2001
Filing Date:
March 25, 1998
Export Citation:
Assignee:
Likehold Chemicals, Inc.
International Classes:
B65B63/08; B65D75/00; C09J201/00; (IPC1-7): B65B63/08; C09J201/00
Attorney, Agent or Firm:
Nao Okuyama (3 others)