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Title:
METHOD AND DEVICE FOR PACKAGING WITH RESIN
Document Type and Number:
Japanese Patent JPH07106361
Kind Code:
A
Abstract:

PURPOSE: To make it possible to improve the utilization efficiency of a resin, to make it possible to prevent the generation of voids, breaks or the like in a packing part and to make it possible to shorten the exchange time of a metal mold by a method wherein a thermosetting resin material molded so as to coincide with the internal form of an oblong runner is sent by the application toward cavities by the use of a movable runner and the like.

CONSTITUTION: A thermosetting resin material 19 formed of a prescribed volume of resin is prepared so as to roughly coincide with the internal form of an oblong runner 5. After a mold opening is performed, lead frames are respectively positioned and held at sites of the upper surface of a plurality of cavities 15A formed via gates 6 at the positions in roughly line symmetry to the longitudinal direction of the runner 5. Then, the material 19 is put in the runner 5 and after a mold mold closing is performed, the material 19 is pressure-sent toward the cavities 15A and cavities 15B by a movable runner 1, which is driven in the runner 5, and a resin packing is performed. Then, after a mold opening is performed, an integrally constituted material consisting of the frames 3 subsequent to the end of the resin packaging is taken out outside of a metal mold.


Inventors:
YONEZU MINETOSHI
SAKAMOTO HIDEO
Application Number:
JP24548393A
Publication Date:
April 21, 1995
Filing Date:
September 30, 1993
Export Citation:
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Assignee:
TAMUSU TECHNOL KK
International Classes:
B29C45/02; B29C45/14; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02
Domestic Patent References:
JPS57128931A1982-08-10
JPH01232733A1989-09-18
Attorney, Agent or Firm:
Yasunori Otsuka (1 person outside)



 
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